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 |  TUESDAY, June 8, 2004, 2:00 PM - 4:00 PM | Room: 6B |
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TOPIC AREA: BUSINESS
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SESSION 7
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| Panel: When IC Yield Missed the Target, Who is at Fault?
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| Chair: Lucio Lanza - Lanza techVentures, Palo Alto, CA
| | Organizers: Andrzej Strojwas
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| Silicon yield once was dominated by contaminants and particulates, making yield a process issue. But with today's electronics supply chain, multiple suspects may be indicted on manufacturability issues. Who is responsible for preventive actions in manufacturability and yield? The panelists, representing a foundry, a fabless company, an IP provider, two EDA vendors, and an IC design team, will discuss the problems and solutions for achieving manufacturability and yield goals.
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| 7.1 |
When IC yield misses the target, who is at fault?
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| Speaker(s): | Michael Campbell - QualComm, San Diego, CA
Vassilios C. Gerousis - Infineon Tech, Munich, Germany
John Kibarian - PDF Solutions, Inc, San Jose, CA
Jim Hogan - Telos Venture Partners,
Marc Levitt - Cadence Design Systems, Inc., San Jose, CA
Walter Ng - Chartered Semiconductor, Milpitas, CA
Dipu Pramanik - Synopsys, Mountain View, CA
Mark Templeton - Artisan Components, Inc., Sunnyvale, CA
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